The overall Neonseven experience is about 400 men/years
Research and evaluation of new components
Analysis of product specification and suitable solution proposals
Schematics design
Simulation and hardwired evaluation of specific circuit parts
Definition of board technology
Definition of board layout
Routing of the boards
Simulation of the critical areas of the boards
Electromagnetic field, antenna and acoustic simulations
Cooperation with L1 in tuning of the low level drivers
Simulation of electromagnetic fields (antennas) and acoustics (ringers, loudspeaker)
Support for legal certification and customer acceptance tests
S1 - System integration and Application Development
SW integration and build management
RTOS optimizations
multimedia and MMI development
m2m framework design
Tcp/Ip connectivity
Embedded linux application development
Design customizations
S2 - Software Layer1 and Protocol Stack
Layer1 software development
RF and DSP drivers development
RF calibrations and test procedures
Protocol Stack software enhancements and customizations
Full Type Approval support
SW drivers for HW peripherals
base-band system
audio
display
keyboard
SIM
memory and NVRAM
battery and charger
accessory
Connectivity drivers
UART
I2C
SPI
Data connectivity software
Security features
Platform tools development and maintenance
Production test system development
Common to software groups:
Product customization
SW groups achievements
R97 PS and Layer1 extension to full dual SIM support
ENS R99 PS extension
Chipset supported EGL,EGR, EGOLD voice, SGOLD2, SGOLD3H
type approvals accomplished: PTCRB
2.75G RF driver development for SMART 3GE
product verification
testing acitivities : system tests, functional tests and field tests on real networks
support to customer in product qualification
support to customer to achieve worldwide certifications: R&TTED (CE-mark), GCF, FCC, PTCRB, and any particular network operators certifications (ex. AT&T)
test systems and methods development
compliance with the ISO7IEC 17025 standard as applicable